Apparatus and method for integrated circuit cooling during testing and image based analysis
AssigneeInternational Business Machines Corporation
InventorsPatrick McGinnis, Darrell Miles, Richard Oldrey, John Sylvestri, Manuel Villalobos
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Abstract
An apparatus for implementing integrated circuit cooling during testing and image-based analysis thereof includes a lid configured to define a cavity surrounding an integrated circuit die, the die mounted to a module substrate. One or more fluid passages are defined within the lid, wherein the passages facilitate the flow of a cooling liquid through said cavity and over the integrated circuit die, and a transparent window is formed within the lid so as to facilitate viewing of the integrated circuit die.
Claims20
An apparatus for implementing integrated circuit cooling during testing and image-based analysis thereof, comprising:
- a lid configured to define a cavity surrounding an integrated circuit die, said die mounted to a module substrate;
- one or more fluid passages defined within said lid, wherein said passages facilitate the flow of a cooling liquid through said cavity and over said integrated circuit die;
- and
- a transparent window formed within the lid so as to facilitate viewing of said integrated circuit die.
An apparatus for implementing integrated circuit cooling during testing and image-based analysis thereof, comprising:
- a test socket mounted to a test circuit board;
- a module substrate mounted to said test socket, said module substrate having an integrated circuit die mounted thereon;
- a lid mounted to said module substrate, said lid configured to define a cavity surrounding said integrated circuit die;
- one or more fluid passages defined within said lid, wherein said passages facilitate the flow of a cooling liquid through said cavity and over said integrated circuit die;
- and
- a transparent window formed within the lid so as to facilitate viewing of said integrated circuit die.
A method for implementing integrated circuit cooling during testing and image-based analysis thereof, the method comprising:
- defining a cavity to surround an integrated circuit die mounted to a module substrate, said cavity formed in a lid covering said module substrate;
- introducing the flow of a cooling liquid through said cavity and over said integrated circuit die, said cooling liquid flowing through one or more fluid passages defined within said lid;
- wherein a transparent window formed within the lid facilitates viewing of said integrated circuit die during the flowing of said cooling liquid.
Dependencies are inferred from the claim text.