Thermally enhanced semiconductor package and method of producing the same

A method of manufacturing a semiconductor package comprising:

• inserting a substrate with an attached semiconductor chip in a first mold portion;
• placing a heat sink structure on top of a portion of the substrate;
• placing a mold release film onto a second mold portion;
• clamping the second mold portion onto a portion of the heat sink structure;
• injecting an encapsulant into a mold cavity formed by the first and second mold portions, wherein the encapsulant surrounds portions of the substrate, semiconductor chip and heat sink structure;
• curing the encapsulant, whereby the heat sink structure adheres to the encapsulant;
• removing the encapsulated assembly from the mold;
• singulating the encapsulated assembly to form a semiconductor package.

A semiconductor package comprising:

• a semiconductor chip attached to a substrate;
• an encapsulant covering portions of the semiconductor chip and substrate and comprising a top surface;
• and
• a heat sink in direct contact with the entire top surface of the encapsulant;
• wherein the heat sink becomes adhered to the top surface of the encapsulant as the encapsulant cures;
• wherein a notch at a top corner of semiconductor package is filled with the encapsulant' and
• wherein notch acts as an interlock for the heat sink.