Apparatus and methods for packaging dielectric resonator antennas with integrated circuit chips
AssigneeInternational Business Machines Corporation
InventorsZhi Chen, Brian Gaucher, Duixian Liu, Ullrich Pfeiffer, Thomas Zwick
Life of this patent
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Abstract
Apparatus and methods are provided for integrally packaging antenna devices with semiconductor IC (integrated circuit) chips, wherein IC chips are packaged with dielectric resonators antennas that are integrally constructed as part of a package molding (encapsulation) process, for example, to form compact integrated radio/wireless communications systems for millimeter wave applications.
Claims22
An electronic apparatus, comprising:
- an IC (integrated circuit) chip;
- and
- a DRA (dielectric resonator antenna), wherein the IC chip and DRA are integrally packaged together in a chip-scale scale package.
An electronic package apparatus, comprising:
- a package frame;
- an IC (integrated circuit) chip mounted to the package frame, the IC chip having an antenna feed network formed on an active surface thereof;
- a dielectric resonator antenna stacked on the active surface of the IC chip and aligned to a portion of the feed network;
- and
- a package cover.
An electronic package apparatus, comprising:
- a package substrate;
- an IC (integrated circuit) chip mounted to a first region of the package substrate;
- a dielectric resonator antenna stacked on a second region of the package substrate adjacent the first region;
- a feed network formed on the package substrate between the first and second regions;
- and
- a package cover.
A method for constructing an electronic package apparatus, comprising integrally packaging an IC chip and DRA (dielectric resonator antenna) together in a chip-scale package.
Dependencies are inferred from the claim text.