Semiconductor Module Comprising Semiconductor Chips and Method for Producing the Same

A method for producing a plurality of semiconductor modules comprising semiconductor chips, the method comprising:

• producing a composite body for a plurality of semiconductor modules in semiconductor module positions of the composite body, semiconductor chips being arranged in a plastic housing composition such that active top sides of the semiconductor chips and a top side of the plastic housing composition form a coplanar area that is a coplanar underside of the semiconductor modules in the semiconductor module positions;
• applying a wiring structure to the coplanar area, the wiring structure including:
• center regions with external contact areas, the center regions corresponding to the semiconductor module positions;
• and edge regions with contact pads, the edge regions being disposed along peripheries of the semiconductor module positions;
• populating the edge regions of the semiconductor module positions with surface-mountable semiconductor components having surface-mountable contacts that are electrically connected to the contact pads;
• applying external contacts on the external contact areas;
• and
• separating the composite body into individual semiconductor modules.