Managed memory component

A circuit module comprising:

• flex circuitry having first and second sides, the flex circuitry having a plurality of leaded IC pads and the second side of the flex circuitry having an array of module contacts, the flex circuitry comprising multiple layers including at least first and second conductive layers and the flex circuitry having a window that passes through the flex circuitry;
• a leaded packaged IC having a body and upper and lower major surfaces, plural peripheral sides, and leads emergent from at least a first one of the plural peripheral sides of the leaded packaged IC, the leads being connected to the flex circuitry through the plurality of leaded IC pads and the lower major surface of the leaded packaged IC being in contact with the first side of the flex circuitry;
• and
• a semiconductor die attached the body of the leaded packaged IC and which die projects into the window of the flex circuitry and which semiconductor die is electrically connected to one of the first or second conductive layers of the flex circuitry.

A circuit module comprising:

• flex circuitry having first and second sides, the flex circuitry having a plurality of leaded IC pads and the second side of the flex circuitry having an array of module contacts, the flex circuitry comprising multiple layers including at least first and second conductive layers and the flex circuitry having at least one window that passes through the flex circuitry;
• a leaded packaged IC having a body and upper and lower major surfaces, plural peripheral sides, and leads emergent from at least a first one of the plural peripheral sides of the leaded packaged IC, the leads being connected to the flex circuitry through the plurality of leaded IC pads;
• and
• a semiconductor die attached the body of the leaded packaged IC and which semiconductor die is electrically connected to one of the first or second conductive layers of the flex circuitry with wire bonds that pass through the at least one window through the flex circuitry.