Light emitting diode packaging structure
OwnerRobert Yeh, Shih-Jen Chuanginventors
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Abstract
A light emitting diode (LED) packaging structure includes a package body, a lead frame and a reflective wall. The package body includes a chip accommodating space for an LED chip, and a portion of the lead frame is exposed to the chip accommodating space. The reflective wall is connected with the lead frame and extendedly bends from the lead frame to cover a sidewall of the accommodating space so that rays of the LED chip can reflect from the reflective wall mostly.
Claims14
A light emitting diode (LED) packaging structure comprising:
- a packaging body having a chip accommodating space for accommodating an LED chip;
- a lead frame, a portion of which is exposed to the chip accommodating space;
- and
- a reflective wall connected to the lead frame and extendedly bending from the lead frame to cover a sidewall of the accommodating space so that rays of the LED chip are mostly reflected from the reflective wall.
A manufacturing method of an LED packaging structure, comprising the steps of:
- using a plate material to form a first lead frame and a reflective wall connected to the lead frame;
- and
- using a packaging body to cover a portion of the first lead frame, a portion of a second lead frame, and the reflective wall by injection molding.
A manufacturing method of an LED packaging structure, comprising the steps of:
- using a plate material to form a first lead frame and a reflective wall connected to the lead frame;
- using a packaging body to cover a portion of the first lead frame, a portion of a second lead frame, and the reflective wall by injection molding;
- implementing a chip fixing step to fix an LED chip on any of the lead frames;
- implementing a bonding step to electrically connect the LED chip and the other lead frame without the LED chip;
- and
- implementing a gluing step to fill a chip accommodating space of the packaging body.
Dependencies are inferred from the claim text.