Leadless lead-frame
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorChao-Ming Tseng
Life of this patent
Estimating the term…
Abstract
A leadless lead-frame mainly includes a chip paddle and a plurality of leads. The chip paddle has chip disposal areas, and a grounding area surrounding the chip disposal area. The grounding area has a recession with a recession-bottom and a recession-wall connecting to the recession-bottom. An angle is formed between the recession-wall and the recession-bottom, and the angle is less than 90 degrees. The leads surround the chip paddle. The chip paddle has a cavity and the cavity has a cavity-bottom serving as the chip disposal area, and the depth of the cavity is equal to half of the thickness of the chip paddle.
Claims12
A leadless lead-frame comprising:
- a chip paddle having chip disposal areas, and a grounding area surrounding the chip disposal area, wherein the grounding area having a recession with a recession-bottom and a recession-wall connecting to the recession-bottom, an angle is formed between the recession-wall and the recession-bottom and the angle is less than 90 degrees;
- and
- a plurality of leads surrounding the chip paddle, the chip paddle having a cavity and the cavity having a cavity-bottom serving as the chip disposal area, and the depth of the cavity is equal to half of the thickness of the chip paddle.
A package, comprising:
- a lead-frame, comprising:
- a chip paddle having chip disposal areas, and a grounding area surrounding the chip disposal area, wherein the grounding area having a recession with a recession-bottom and a recession-wall connecting to the recession-bottom, an angle is formed between the recession-wall and the recession-bottom and the angle is less than 90 degrees;
- and
- a plurality of leads surrounding the chip paddle, the chip paddle having a cavity and the cavity having a cavity-bottom serving as the chip disposal area, and the depth of the cavity is equal to half of the thickness of the chip paddle;
- and
- a chip disposed in the cavity of the chip paddle of the lead-frame and attached to the lead-frame, and the chip having an active surface and a back surface opposed to the active surface
Dependencies are inferred from the claim text.