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US 2007/0164401 A1Published application
Differential transmission line structure and wiring substrate
AssigneeShinko Electric Industries Co., Ltd.
InventorTsutomu Higuchi
Life of this patent
Estimating the term…
Abstract
A differential transmission line structure comprises an insulating layer, a grounded conductive layer laminated to the insulating layer, and a differential transmission line formed in the insulating layer. A region in which the conductive layer is removed is formed in correspondence with a position of the differential transmission line.
Claims7
A differential transmission line structure comprising:
- an insulating layer;
- a grounded conductive layer laminated to the insulating layer;
- and
- a differential transmission line formed in the insulating layer,
- wherein a region in which the conductive layer is removed is formed in correspondence with a position of the differential transmission line.
2 more elements
A wiring substrate comprising:
- a differential transmission line structure, the differential transmission line structure having an insulating layer, a grounded conductive layer laminated to the insulating layer, and a differential transmission line formed in the insulating layer,
- wherein a region in which the conductive layer is removed is formed in correspondence with a position of the differential transmission line.
Dependencies are inferred from the claim text.