Integrated mems package
AssigneeHoneywell International Inc.
InventorDouglas MacGugan
Life of this patent
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Abstract
Systems and methods of fabricating an integrated Micro-Electro-Mechanical Systems (MEMS) package. The MEMS package includes a substrate that has a substantially planar first surface including a cavity configured to receive a MEMS die. A substantially planar second surface is parallel to and spaced apart from the first surface. The second surface is configured to receive a flip chip. The MEMS die is inserted into the cavity. The flip chip is affixed to the substrate to establish operative connection between the MEMS die and the flip chip through traces in the substrate.
Claims29
A substrate as a component of an integrated MEMS package, the substrate comprising:
- a substantially planar first surface, the first surface defining a cavity configured to receive a MEMS die;
- a substantially planar second surface parallel to and spaced apart from the first surface, the second surface configured to receive a flip chip;
- and
- a plurality of conductive traces configured to conduct electrons, in the presence of the MEMS die and flip chip, from the MEMS die to the flip chip in operative connection.
A method of fabricating an integrated MEMS package, the method comprising:
- providing a substrate having:
- a substantially planar first surface, the first surface defining a cavity configured to receive a MEMS die;
- a substantially planar second surface parallel to and spaced apart from the first surface, the second surface configured to receive a flip chip;
- and
- a plurality of conductive traces;
- inserting the MEMS die into the cavity;
- affixing the flip chip to the substrate to establish operative connection between the MEMS die and the flip chip through the traces.
An integrated MEMS package comprising:
- a substrate having:
- a substantially planar first surface, the first surface defining a cavity configured to receive a MEMS die;
- a substantially planar second surface parallel to and spaced apart from the first surface, the second surface configured to receive a flip chip;
- and
- a plurality of conductive traces configured to conduct electrons, in the presence of the MEMS die and flip chip, from the MEMS die to the flip chip in operative connection;
- a MEMS die engaged in the cavity;
- and
- a flip chip engaged on the second surface in operative communication with the MEMS die.
Dependencies are inferred from the claim text.