Back to results
US 2007/0164349 A1Published application
Circuit board, circuit apparatus, and method of manufacturing the circuit board
AssigneeSanyo Electric Co., Ltd.
InventorsMayumi Nakasato, Makoto Murai, Ryosuke Usui, Hideki Mizuhara, Yasunori Inoue
Life of this patent
Estimating the term…
Abstract
A circuit board includes a substrate and an insulating layer. The substrate has a first surface. The insulating layer has a second surface and is connected to the substrate. The first surface is in contact with the second surface. Heat-conductive particles are provided in the insulating layer. A part of the particles projects from the second surface of the insulating layer and is in contact with the first surface of the substrate.
Claims19
A circuit board comprising:
- a substrate having a first surface;
- an insulating layer having a second surface and connected to said substrate, the first surface being in contact with the second surface;
- and
- heat-conductive particles provided in said insulating layer, a part of said particles projecting from the second surface of said insulating layer and being in contact with the first surface of said substrate.
1 more element
A circuit apparatus comprising:
- a substrate having a first surface;
- an insulating layer having a second surface and connected to said substrate, the first surface being in contact with the second surface;
- heat-conductive particles provided in said insulating layer, a part of said particles projecting from the second surface of said insulating layer and being in contact with the first surface of said substrate;
- and
- a circuit element provided on the insulating layer.
2 more elements
A method of manufacturing a circuit board comprising:
- providing a substrate;
- and
- press-bonding an insulating layer including heat-conductive particles to said substrate in a press-bonding direction.
Dependencies are inferred from the claim text.