Loading patent…
AssigneeFujitsu Limited
InventorsMasanori Onodera, Susumu Moriya, Izumi Kobayashi, Hiroshi Aoki, Toshiyuki Honda
Estimating the term…
In a camera module of a so-called multi-chip type, an imaging device and a semiconductor element for processing are mounted. The semiconductor element is encapsulated by a mold resin. Protruding parts are formed by the mold resin on a mounting surface of the mold resin. A metal film forming a pattern wiring is formed on the mounting surface of the mold resin. The metal film is also formed on the protruding parts so as to constitute external connection terminals together with the protruding parts. Electrodes of the semiconductor element are electrically connected to the pattern wiring. The protruding parts include first protruding parts positioned around the semiconductor element and second protruding parts formed in a mounting area of the semiconductor element on the mounting surface.
A manufacturing method of a semiconductor device comprising the steps of:
A manufacturing method of a camera module, comprising the steps of:
Dependencies are inferred from the claim text.