Forming method of Micro SD card
OwnerEn-Min Jowinventor
Life of this patent
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Abstract
A forming method of Micro SD card (Micro Secure Digital Memory card) is provided. The plurality of Micro SD card module substrates is located on the substrate and connecting every adjacent module substrates with the plurality of connecting bars. After placing the chip to the proper location and molding the whole module. In order to polish the Micro SD card from rough surface to smooth and clear the plurality of bumps that caused by the punch step, utilizing the plurality of steps, such as punch, grind and chamfer to achieve the goal to smooth the Micro SD surface and reduce the cost.
Claims11
A forming method of micro secure digital card, comprising:
- providing a substrate having a plurality of micro secure digital card module substrates, wherein every said micro secure digital card module substrate is connected with said substrate and adjacent said micro secure digital card module substrates with a plurality of connecting bars;
- covering said plurality of micro secure digital card module substrates by a molding material to form a plurality of micro secure digital card assemblies;
- dismembering said plurality of connecting bars to separate said plurality of individual micro secure digital card assemblies;
- and
- smoothing every said individual micro secure digital card assembly.
A forming method of micro secure digital card, comprising:
- providing a substrate having a plurality of micro secure digital card module substrates thereon, wherein every said micro secure digital card module substrate is connected with said substrate and adjacent said micro secure digital card module substrates with a plurality of connecting bars;
- placing a chip on each of said micro secure digital card module substrates;
- covering said plurality of micro secure digital card module substrates and said chips by a molding material to form a plurality of micro secure digital card assemblies;
- dismembering said plurality of connecting bars to separate said plurality of individual micro secure digital card assemblies;
- grinding a portion of said plurality of connecting bars of said plurality of individual micro secure digital card assemblies;
- and
- chamfering every said plurality of individual micro secure digital card assemblies.
The forming method of micro secure digital card according to claim 9, wherein said molding material is made of epoxy.
Dependencies are inferred from the claim text.