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US 2007/0164089 A1Published application
Method of dispensing small amounts of liquid material
AssigneeNordson Corporation
InventorKevin Gaugler
Life of this patent
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AssigneeNordson Corporation
InventorKevin Gaugler
Estimating the term…
A method of dispensing a solder paste comprising at least a flux carrier and solder onto a substrate, wherein the flux carrier and solder each have a melting temperature with the melting temperature of the solder being higher than the flux carrier, includes providing a reservoir of the solder paste and supplying the solder paste to a dispenser having an outlet through which the solder paste is dispensed. The solder paste is heated to a temperature of at least the melting temperature of the solder so that the flux carrier and solder are in a molten state. An amount of the solder paste is dispensed through the outlet and onto the substrate. The flux carrier and solder in the reservoir are maintained at a temperature below the melting temperature of the flux carrier so that neither of the flux carrier and solder is in a molten state in the reservoir.
A method of dispensing a solder paste comprising at least a flux carrier and solder onto a substrate, the flux carrier and solder each having a melting temperature with the melting temperature of the solder being higher than the melting temperature of the flux carrier, the method comprising:
A method of dispensing a solder paste comprising at least a flux carrier and solder onto a substrate, the flux carrier and solder each having a melting temperature with the melting temperature of the solder being higher than the melting temperature of the flux carrier, the method comprising:
Dependencies are inferred from the claim text.