Loading patent…
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsMasato Mori, Hiroaki Onishi, Masato Hirano, Kazuto Nishida
Estimating the term…
An electronic component mounting method comprising: supplying an unhardened reinforcing resin on a circuit substrate; supplying a solder paste on bond areas of the circuit substrate on which electrodes of the electronic components are to be bonded; placing the electronic components on the circuit substrate; and heating and then cooling the circuit substrate with the reinforcing resin, the solder paste, and the electronic components carried thereon. The mounting method enables mounting of components with high joint reliability, while incorporating the conventional surface mount process steps. The method may also be applied to the mounting of smaller electronic components with narrower pitch without deteriorating productivity or mounting quality.
An electronic component mounting method in which joints between a circuit substrate and electronic components are reinforced using a resin, the method comprising:
A circuit substrate comprising a sheet-form resin arranged on a surface on which electronic components are to be bonded, the resin being softened by heat applied during heating for reflow of a solder paste to allow the molten solder above to flow down onto the circuit substrate.
A circuit substrate unit, comprising:
Dependencies are inferred from the claim text.