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AssigneeDisco Corporation
InventorsYosuke Watanabe, Keiji Nomaru, Nobumori Ogoshi, Koichi Mitani, Taizo Kise, Kohei Matsumoto, Tatsuya Inaoka, Masaru Nakamura
Estimating the term…
A method of dividing, along lattice pattern-like dividing lines, a wafer which has the lattice pattern-like dividing lines and a polymer film on the front surface of a substrate and is processed to allow for division along the dividing lines, the method comprising a frame holding step for putting the wafer on the surface of an adhesive tape mounted on an annular frame; a wafer cooling step for cooling the wafer that is affixed to the surface of the adhesive tape mounted on the annular frame; and a diving step for dividing the wafer along the dividing lines by expanding the adhesive tape to which the cooled wafer is affixed.
A method of dividing, along lattice pattern-like dividing lines, a wafer which has the dividing lines and a polymer film on the front surface of a substrate and is processed to allow for division along the dividing lines, the method comprising:
A wafer dividing apparatus for dividing a wafer which is put on an adhesive tape mounted on an annular frame so as to cover its inner opening, along predetermined dividing lines, the apparatus comprising:
Dependencies are inferred from the claim text.