Substrate dividing apparatus and method for dividing substrate
OwnerYoshitaka Nishioinventor
Life of this patent
Estimating the term…
Abstract
A substrate cutting apparatus for cutting a substrate includes a scribe line forming means for forming a scribe line on a substrate and a breaking means for breaking the substrate along the scribe line. The breaking means includes means for spraying a heated fluid having a temperature sufficient to cause expansion of the substrate onto the scribe line formed so as to further extend a vertical crack extending from the scribe line in the thickness direction of the substrate.
Claims19
A substrate cutting apparatus for cutting a plurality of unit substrates from a mother substrate, comprising:
- a scribe line forming means for forming a scribe line on the mother substrate, and
- a breaking means for breaking the mother substrate along the scribe line,
- wherein the breaking means includes means for spraying steam onto the scribe line formed on the mother substrate so as to penetrate the steam into a vertical crack extending from the scribe line, and for expanding the mother substrate by the penetrated steam so as to further extend the vertical crack in the thickness direction of the mother substrate without applying any bending moment to the mother substrate.
A substrate cutting method for cutting a plurality of unit substrates from a mother substrate, comprising:
- a scribe line forming step of forming a scribe line on the mother substrate, and
- a breaking step of breaking the mother substrate along the scribe line,
- wherein the breaking step includes a step of spraying steam onto the scribe line formed on the mother substrate so as to penetrate the steam into a vertical crack extending from the scribe line, and expanding the mother substrate by the penetrated steam so as to further extend the vertical crack in the thickness direction of the mother substrate without applying any bending moment to the mother substrate.
Dependencies are inferred from the claim text.