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US 2007/0163992 A1Published application
Method and device for contacting semiconductor chips
AssigneeAssa Abloy AB
InventorsMartin Michalk, Manfred Michalk, Sabine Nieland
Life of this patent
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AssigneeAssa Abloy AB
InventorsMartin Michalk, Manfred Michalk, Sabine Nieland
Estimating the term…
The invention relates to a method and device that make it possible to increase the productivity of the chip bonding and the before and after working steps associated with the chip bonding. To this end, the invention provides a method for contacting semiconductor chips (3) on a metallic substrate (16), whereby an etch resist (27) is located at least on one substrate side, and semiconductor chips (3) are contacted on the contacting side (30) by means of flip-chip bonding processes, during which a contacting region (7) is created on the contacting side (30) of the substrate (16). A semiconductor chip (3) having two contact bumps (6) is contacted on said contacting region in such a manner that: a contact bump (6) is contacted on both sides of a structure line (35) or of a structure trench (13) dividing the contacting region (7), and; after the contacting, an underfilling of the chip (3) ensues after which an electrically insulating passage (14) is made in the contacting region (7), and a module (32), which supports the semiconductor chip (3), is removed from the substrate (16).
A method for contacting semiconductor chips (3) on a metal substrate (16), there being an etching resist (27) on at least one substrate side and semiconductor chips (3) being contacted by means of the flip-chip bonding method on the contacting side (30), characterized in that a contacting zone (7) is produced on the contacting side (30) of the substrate (16), on which a semiconductor chip (3) with two contact bumps (6) is contacted so that a contact bump (6) is contacted on each of the two sides of a structure line (35) or a structure trench (13) dividing the contacting zone (7), and in that the chip (3) is underfilled after the contacting and an electrically insulating hole (14) is then produced in the contacting zone (7) and a module (32) carrying the semiconductor chip (3) is separated from the substrate (16).
A support strip for chip modules (32), in which there is an etching resist (27) on a metal substrate (16) and contacting zones (7), on which semiconductor chips (3) can be contacted, are arranged on the front side (30) of the substrate (16), characterized in that the substrate (16) is formed as a thin flat piece in which there are resist layers (27.1, 27.2), which are provided with structures, on the contacting side (30) and the rear side (31).
Dependencies are inferred from the claim text.