Conformable Contact Masking Methods and Apparatus Utilizing In Situ Cathodic Activation of a Substrate
AssigneeUniversity of Southern California
InventorGang Zhang
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AssigneeUniversity of Southern California
InventorGang Zhang
Estimating the term…
Electroplating processes (e.g. conformable contact mask plating and electrochemical fabrication processes) that include in situ activation of a surface onto which a deposit will be made are described. At least one material to be deposited has an effective deposition voltage that is higher than an open circuit voltage, and wherein a deposition control parameter is capable of being set to such a value that a voltage can be controlled to a value between the effective deposition voltage and the open circuit voltage such that no significant deposition occurs but such that surface activation of at least a portion of the substrate can occur. After making electrical contact between an anode, that comprises the at least one material, and the substrate via a plating solution, applying a voltage or current to activate the surface without any significant deposition occurring, and thereafter without breaking the electrical contact, causing deposition to occur.
An electrochemical fabrication process for producing a three-dimensional structure from a plurality of adhered layers, the process comprising:
An electrochemical fabrication process for producing a three-dimensional structure from a plurality of adhered layers, the process comprising:
An electrochemical fabrication process for producing a three-dimensional structure from a plurality of adhered layers, the process comprising:
Dependencies are inferred from the claim text.