Electronic package including an electromagnetic shield
AssigneeTriquint Semiconductors, Inc.
InventorDean Monthei
Life of this patent
Estimating the term…
Abstract
One embodiment of n electromagnetically shielded electronic package includes a substrate having an exposed surface, a grounding structure at least partially exposed on the exposed surface and at least one electrical component positioned on the exposed surface, a conductive structure secured to the exposed surface and in contact with the grounding structure, a non-conductive layer formed on the exposed surface and covering the at least one electrical component and at least partially covering the conductive structure, and a conductive layer formed on the non-conductive layer and in contact with the conductive structure.
Claims31
A shielded electronic package, comprising:
- a multi-layer substrate including an exposed surface, a grounding structure at least partially exposed on said exposed surface and at least one electrical component positioned on said exposed surface;
- a conductive structure secured to said exposed surface and in contact with said grounding structure;
- a non-conductive layer formed on said exposed surface and covering said at least one electrical component and at least partially covering said conductive structure;
- and
- a conductive layer formed on said non-conductive layer and in contact with said conductive structure.
A shielded electronic assembly, comprising:
- a multi-layer substrate including electronic components therein and a ground conductor;
- a conductive layer formed on exterior surface of said substrate;
- a non-conductive layer positioned between said substrate and said conductive layer wherein said non-conductive layer electrically isolates said conductive layer and said substrate from one another;
- and
- a conductive device that extends through said nonconductive layer and is electrically connected to said ground conductor and to said conductive layer.
A microelectronic device, comprising:
- a multi-layer stack including a ground layer and a signal layer;
- and
- an electromagnetic shield layer formed directly on the multi-layer stack as a topmost layer.
A method of making a multi-layer substrate including an electromagnetic shield, comprising:
- forming a conductive member on a top surface of a multi-layer substrate, said conductive member electrically connected to an electrical ground of said multi-layer substrate;
- forming a non-conductive layer on said top surface;
- and
- forming a conductive layer on said non-conductive layer, said conductive layer electrically connected to said conductive member;
- wherein said non-conductive layer electrically isolates said multi-layer substrate from said conductive layer.
The method of 23 wherein said first height is in a range of 300 to 1450 microns.
A method of making an electromagnetic shield on a multi-layer substrate comprising:
- bonding a wire to a top surface of said multi-layer substrate;
- forming a non-conductive layer on said top surface, said non-conductive layer at least partially surrounding said wire;
- and
- forming a conductive layer on said non-conductive layer, wherein said wire electrically connects said conductive layer and a ground layer of said multi-layer substrate.
A microelectronic device, comprising:
- a substrate including a grounding structure and microelectronic components;
- means for electrically isolating said microelectronic components;
- means for electromagnetically shielding said microelectronic components;
- and
- means for electrically connecting said grounding structure and said means for electromagnetically shielding, said means for electrically connecting extending through said means for electrically isolating.
Dependencies are inferred from the claim text.