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US 2007/0163709 A1Published application
Hybrid components containing reactive hotmelt adhesives
AssigneeDegussa AG
InventorsMartin RISTHAUS, Hans-Joachim Wonicker
Life of this patent
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Abstract
Reactive hotmelt adhesives based on copolyamide can be used in hybrid components. These hybrid components find application in, for example, vehicle construction and aircraft construction.
Claims11
A process for producing a hybrid component, comprising:
- bonding a metal to a polymer with a copolyamide-based hotmelt adhesive;
- thereby obtaining said hybrid component comprising said metal and said polymer.
Dependencies are inferred from the claim text.