Copper cmp slurry composition
AssigneeTechnion Research & Development Foundation Limited
InventorsYair Ein-Eli, David Starosvetsky, Esta Abelev, Eugene Rabkin
Life of this patent
Estimating the term…
Abstract
A composition that rapidly passivates copper-containing surface to yield a uniform layer of insoluble copper oxide, the composition being useful in chemical-mechanical planarization of copper-containing surfaces is disclosed. The composition is a solution having a pH of equal to or greater than 9 and having an oxidation potential sufficient to oxidize the surface to form non-soluble copper oxides. Also disclosed are methods of making and using the composition.
Claims56
A composition useful for the formation of a passivating layer on a surface, the surface including more than about 5% copper by weight, comprising a solution having a pH equal to or greater than about 9 and having an oxidation potential sufficient to oxidize the surface to form copper oxides, wherein neither copper nor said copper oxides are substantially soluble in the composition.
5. (canceled)
A method for the preparation of a composition useful for the formation of a passivating layer on a surface, the surface including more than about 5% copper by weight, comprising preparing a solution having a pH equal to or greater than about 9 and having an oxidation potential sufficient to oxidize the surface to form copper oxides, wherein neither copper nor said copper oxides are substantially soluble in the composition.
5. (canceled)
Dependencies are inferred from the claim text.