Single crystal and semiconductor wafer and apparatus and method for producing a single crystal
AssigneeSiltronic AG
InventorsLaszlo Fabry, Gunter Strebel, Hans Oelkrug
Life of this patent
Estimating the term…
Loading patent…
AssigneeSiltronic AG
InventorsLaszlo Fabry, Gunter Strebel, Hans Oelkrug
Estimating the term…
The disclosure relates to an apparatus and a method for producing a single crystal of semiconductor material. The apparatus comprises a chamber and a crucible which is arranged in the chamber and is enclosed by a crucible heater, a radiation shield for shielding a growing single crystal and thermal insulation between the crucible heater and an inner wall of the chamber. The apparatus may include a resilient seal which seals a gap between the inner wall and the thermal insulation and forms an obstacle for the transport of gaseous iron carbonyls to the single crystal. The disclosure also relates to a method for producing a single crystal of semiconductor material by using the apparatus, the single crystal which is produced and a semiconductor wafer cut therefrom. The single crystal and the semiconductor wafer are distinguished by an edge region, which extends from the circumference to a distance of up to R-5 mm radially into the single crystal or the semiconductor wafer and has an iron concentration, wherein the iron concentration in the edge region is less than 1*109 atoms/cm3.
An apparatus for producing a single crystal of semiconductor material, the apparatus comprising:
A seal for use in an apparatus for producing a single crystal of semiconductor material, the apparatus including a chamber defining an inner wall, a crucible disposed in the chamber, a crucible heater substantially surrounding the crucible, a radiation shield for shielding the single crystal, and thermal insulation disposed between the crucible heater and the inner wall of the chamber, the thermal insulation and the inner wall defining a gap therebetween, the seal comprising:
A system for reducing transport of gaseous iron carbonyls to a single crystal in a crystal-growing apparatus, the apparatus including a chamber defining an inner wall, a crucible disposed in the chamber, a crucible heater substantially surrounding the crucible, a radiation shield for shielding the single crystal, and thermal insulation disposed between the crucible heater and the inner wall of the chamber, the thermal insulation and the inner wall defining a gap therebetween, the system comprising:
A method for producing a single crystal of semiconductor material by pulling the single crystal from a crucible in a chamber that defines an inner wall, wherein the crucible is substantially surrounded by a crucible heater, and further wherein a thermal insulation is disposed within the chamber and the thermal insulation and the inner wall define a gap therebetween, the method comprising the steps of:
A single crystal of semiconductor material having an iron concentration, the single crystal comprising a section of substantially cylindrical shape defining a circumference, a radius (R) and an edge region extending from the circumference to a distance of R-5 mm radially into the single crystal, wherein the iron concentration in the edge region is less than 1*109 atoms/cm3.
A semiconductor wafer having an iron concentration and defining a circumference, a radius (R) and an edge region extending from the circumference to a distance of R-5 mm radially into the semiconductor wafer, wherein the iron concentration in the edge region is less than 1*109 atoms/cm3.
Dependencies are inferred from the claim text.