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US 2007/0163269 A1Published application
Heat dissipation module
AssigneeASUSTeK COMPUTER INC.
InventorsChao-Tsai Chung, Kuo-Hua Chang
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Abstract
A heat dissipation module suitable for performing heat dissipation on a heat source is provided. The heat dissipation module includes a first base, a first radiator, a thermoelectric cooler and a second radiator. The first base has a first surface and a second surface, wherein the first surface contacts the heat source. Both the first radiator and the thermoelectric cooler contact the second surface, while the second radiator is disposed on the thermoelectric cooler.
Claims8
A heat dissipation module, suitable for performing heat dissipation on a heat source, the heat dissipation module comprising:
- a first base, having a first surface and a second surface, wherein the first surface contacts the heat source;
- a first radiator, contacting the second surface;
- a thermoelectric cooler, contacting the second surface;
- and
- a second radiator, disposed on the thermoelectric cooler.
2 more elements
Dependencies are inferred from the claim text.