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US 2007/0163173 A1Published application
Superabsorbent polymer root dip
AssigneeAbsorbent Technologies, Inc.
InventorMilan Savich
Life of this patent
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Abstract
A superabsorbent polymer (“SAP”) root dip composition and methods of delivering a SAP to a plant are disclosed. A root structure of a plant may be dipped into a SAP hydrogel. The plant may then be planted, stored or transported for subsequent planting.
Claims21
A method of delivering a superabsorbent polymer to a plant, comprising:
- obtaining a superabsorbent polymer hydrogel;
- obtaining a plant having a root structure;
- dipping at least a portion of the root structure of the plant into the superabsorbent polymer hydrogel;
- and
- removing the root structure from the superabsorbent polymer hydrogel.
2 more elements
A method of delivering a superabsorbent polymer to a plant or plant cutting, comprising:
- dipping a portion of the plant or plant cutting into a starch-graft superabsorbent polymer hydrogel;
- removing the plant or plant cutting from the superabsorbent polymer hydrogel;
- and
- planting the plant or plant cutting into soil after removal from the superabsorbent polymer hydrogel.
1 more element
A root dip composition, comprising:
- a superabsorbent polymer product;
- and
- an effective amount of water mixed with the superabsorbent polymer product to form a hydrogel having a viscosity sufficient to coat a plant root dipped therein.
Dependencies are inferred from the claim text.