Method for fabricating conductive blind via of circuit substrate
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorTe-Chun Wang
Life of this patent
Estimating the term…
Abstract
A method for fabricating a conductive blind via of a circuit substrate including the following steps is provided. First, the circuit substrate including a first dielectric layer, a patterned circuit layer and a second dielectric layer are provided. The patterned circuit layer including at least a capture pad is disposed between the first dielectric layer and the second dielectric layer. Next, a blind via exposing the capture pad is formed in the second dielectric layer. Then, an electroless plating process is performed to form an electroless copper layer on the capture pad and an inner wall of the blind via. Next, the electroless copper layer on the capture pad is removed. Finally, the blind via is filled with a conductive material to form the conductive blind via.
Claims19
A method for fabricating a conductive blind via of a circuit substrate, the method comprising:
- providing a circuit substrate comprising a first dielectric layer, a patterned circuit layer and a second dielectric layer, wherein the patterned circuit layer is disposed between the first dielectric layer and the second dielectric layer, and the patterned circuit layer comprises at least one capture pad;
- forming a blind via in the second dielectric via, wherein the blind via exposes the capture pad;
- perform an electroless process to form an electroless copper layer on the capture pad and an inner wall of the blind via;
- removing the electroless copper layer on the capture pad;
- and
- filling a conductive material in the blind via to form a conductive blind via.
A method of fabricating a conductive blind via of a circuit substrate, the method comprising:
- providing a circuit substrate comprising a first dielectric layer, a patterned circuit layer and a second dielectric layer, wherein the patterned circuit layer is disposed between the first dielectric layer and the second dielectric layer, and the patterned circuit layer comprising at least one capture pad;
- forming a blind via in the second dielectric layer, wherein the blind via exposes the capture pad;
- performing an electroless process to form an electroless copper layer on the capture pad and an inner wall of the blind via;
- forming a copper layer on the electroless copper layer;
- removing the electroless copper layer and the copper layer over the capture pad;
- and
- filling a conductive material in the blind via to form a conductive bind via.
Dependencies are inferred from the claim text.