Method for manufacturing a multilayer flexible wiring board
AssigneeSony Chemical & Information Device Corporation
InventorYutaka Kaneda
Life of this patent
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Abstract
In one embodiment, the present invention provides a process for manufacturing a multilayer flexible wiring board, which allows individual layers of wiring boards to be precisely positioned and to be readily stacked. A mask for exposure is prepared in which a plurality of pattern holes corresponding to individual layers of wiring boards of a multilayer flexible wiring board are arranged in the direction perpendicular to the transporting direction P of substrate. This mask for exposure is used to form a plurality of wiring patterns corresponding to individual layers of wiring boards of a multilayer flexible wiring board on the same sheet-like substrate.
Claims3
-10. (canceled)
A method for manufacturing a multilayer flexible wiring board, comprising:
- preparing a sheet-like flexible substrate comprising a metal foil and a resin layer formed on the metal foil and configured to be transported in a predetermined direction, and a mask for exposure comprising a sheet-like mask body and a plurality of pattern holes formed in the mask body and a group of the pattern holes corresponding to wiring patterns of individual layers of a multilayer flexible wiring board are directly arranged in width direction of the mask body and a plurality of the groups of the pattern holes corresponding to wiring patterns of the individual layers of multilayer flexible wiring boards are directly arranged corresponding to the mask in a transporting direction of a flexible board on which a predetermined wiring patterns are to be formed,
- placing the mask for exposure and the flexible substrate to be opposed each other with the metal foil of the flexible substrate facing toward the mask, and
- forming a stock sheet part for a multilayer flexible wiring board by arranging a plurality of wiring patterns in predetermined region of the flexible substrate on a same surface of the flexible substrate through a photolithography process including performing an exposure using the mask.
Dependencies are inferred from the claim text.