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OwnerHem Takiar, Manickam Thavarajah +6inventors
InventorsHem Takiar, Manickam Thavarajah, Ken Wang, Chih-Chin Liao, Andre McKenzie, Shrikar Bhagath, Han-Shiao Chen, Chin-Tien Chiu
Estimating the term…
A strip on which a plurality of integrated circuit package outlines may be fabricated within a plurality of process tools. The strip includes one or more fiducial notches and/or guide pin notches formed in an outer edge of the strip. The one or more fiducial and/or guide pin notches allow a position of the strip to be identified within at least one process tool of the plurality of process tools. By forming the notches in the outer periphery of the strip, the usable area on the strip on which integrated circuit package outlines may be formed is increased. The strip may alternatively include conventional fiducial and/or guide pin holes, with the molding compound applied at least partially around the holes on one or more sides of the strip. The strip may further alternatively include fiducial holes filled with a translucent material that provides stability to the strip while allowing the strip to be used with an optical recognition sensor.
A strip on which a plurality of integrated circuit package outlines are capable of being fabricated within a plurality of process tools, the strip comprising:
A strip on which a plurality of integrated circuit packages are capable of being fabricated within a plurality of process tools, the strip including at least one hole spaced inward from an edge of the strip for allowing registration of a position of the strip within at least one process tool of the plurality of process tools, the strip comprising:
A flash memory formed from a strip including a plurality of integrated circuit package outlines, the strip from which the flash memory is formed comprising:
A strip on which a plurality of integrated circuit package outlines are capable of being fabricated within a plurality of process tools, the strip comprising:
A flash memory formed from a strip including a plurality of integrated circuit package outlines, the strip from which the flash memory is formed comprising:
A method of identifying a position of a strip within a processing tool for forming a portion of an integrated circuit on the strip, the method comprising the steps of:
Dependencies are inferred from the claim text.