Laser processing method

A laser processing method for cutting a flat object to be processed including a substrate and a laminate part disposed on the substrate,

• the method comprising the steps of attaching a protective film to a front face of the object on the laminate part side, irradiating the object with laser light while employing a rear face of the object as a laser light entrance surface and locating a light-converging point within the substrate so as to form a modified region due to multiphoton absorption, causing the modified region to form a cutting start region inside by a predetermined distance from the laser light entrance surface along a line along which the object is intended to be cut, attaching an expandable film to the rear face of the object, applying an external force to the object so as to cut the object into a plurality of parts from the cutting start region acting as a start point, and expanding the expandable film so as to separate the plurality of parts of the object from each other.

A laser processing method for cutting a flat object to be processed including a substrate and a laminate part disposed on the substrate,

• the method comprising the steps of attaching a protective film to a front face of the object on the laminate part side, irradiating the object with laser light while employing a rear face of the object as laser light entrance surface and locating a light-converging point within the substrate so as to form a modified region due to multiphoton absorption, causing the modified region to form a cutting start region inside by a predetermined distance from the laser light entrance surface along a line along which the object is intended to be cut, attaching an expandable film to the rear face of the object, and expanding the expandable film so as to cut the object into a plurality of parts from the cutting start region acting as a start point and separate the plurality of parts of the object from each other.

A laser processing method for cutting a flat object to be processed including a semiconductor substrate and a laminate part disposed on the semiconductor substrate,

• the method comprising the steps of attaching a protective film to a front face of the object on the laminate part side, irradiating the object with laser light while employing a rear face of the object as laser light entrance surface and locating a light-converging point within the semiconductor substrate so as to form a molten processed region, causing the molten processed region to form a cutting start region inside by a predetermined distance from the laser light entrance surface along a line along which the object is intended to be cut, attaching an expandable film to the rear face of the object, and expanding the expandable film so as to separate a plurality of parts produced upon cutting the object from the cutting start region acting as a start point from each other.

A laser processing method for cutting a flat object to be processed including a semiconductor substrate and a laminate part disposed on the semiconductor substrate,

• the method comprising the steps of attaching a protective film to a front face of the object on the laminate part side, irradiating the object with laser light while employing a rear face of the object as a laser light entrance surface and locating a light-converging point within the semiconductor substrate so as to form a molten processed region, causing the molten processed region to form a cutting start region inside by a predetermined distance from the laser light entrance surface along a line along which the object is intended to be cut, attaching an expandable film to the rear face of the object, applying an external force to the object so as to cut the object into a plurality of parts from the cutting start region acting as a start point, and expanding the expandable film so as to separate the plurality of parts of the object from each other.

A laser processing method for cutting a flat object to be processed including a semiconductor substrate and a laminate part disposed on the semiconductor substrate,

• the method comprising the steps of attaching a protective film to a front face of the object on the laminate part side, irradiating the object with laser light while employing a rear face of the as a laser light entrance surface and locating a light-converging point within the semiconductor substrate so as to form a molten processed region, causing the molten processed region to form a cutting start region inside by a predetermined distance from the laser light entrance surface along a line along which the object is intended to be cut, attaching an expandable film to the rear face of the object, and expanding the expandable film so as to cut the object into plurality of parts from the cutting start region acting as a start point and separate the plurality of parts of the object from each other.

A method of manufacturing a semiconductor device formed using a laser processing method for cutting a flat object to be processed including a substrate and a laminate part disposed on the substrate, the manufacturing method comprising:

• attaching a protective film to a front face of the object on the laminate part side, irradiating the object, the object comprising semiconductor material and having a surface formed with at least one semiconductor device, with laser light while employing a rear face of the object as a laser light entrance surface and locating a light-converging point within the substrate so as to form a modified region due to multiphoton absorption, causing the modified region to form a cutting start region inside by a predetermined distance from the laser light entrance surface along a line along which the object is intended to be cut, attaching an expandable film to the rear face of the object, and expanding the expandable film so as to separate a plurality of portions produced upon cutting the object from the cutting start region acting as a start point from each other, with such expanding thereby providing at least one manufactured semiconductor device on a cut portion of the object that is separate from the other cut portions of the object.

A method of manufacturing a semiconductor device formed using a laser processing method for cutting a flat object to be processed including a substrate and a laminate part disposed on the substrate, the manufacturing method comprising:

• attaching a protective film to a front face of the object on the laminate part side, irradiating the object, the object comprising semiconductor material and having a surface formed with at least one semiconductor device, with laser light while employing a rear face of the object as a laser light entrance surface and locating a light-converging point within the substrate so as to form a modified region due to multiphoton absorption, causing the modified region to form a cutting start region inside by a predetermined distance from the laser light entrance surface along a line along which the object is intended to be cut, attaching an expandable film to the rear face of the object, applying an external force to the object so as to cut the object into a plurality of portions from the cutting start region acting as a start point, and expanding the expandable film so as to separate the plurality of portions of the object from each other, with such expanding thereby providing at least one manufactured semiconductor device on a cut portion of the object that is separate from the other cut portions of the object.

A method of manufacturing a semiconductor device formed using a laser processing method for cutting a flat object to be processed including a substrate and a laminate part disposed on the substrate, the manufacturing method comprising:

• attaching a protective film to a front face of the object on the laminate part side, irradiating the object, the object comprising semiconductor material and having a surface formed with at least one semiconductor device, with laser light while employing a rear face of the object as laser light entrance surface and locating a light-converging point within the substrate so as to form a modified region due to multiphoton absorption, causing the modified region to form a cutting start region inside by a predetermined distance from the laser light entrance surface along a line along which the object is intended to be cut, attaching an expandable film to the rear face of the object, and expanding the expandable film so as to cut the object into a plurality of portions from the cutting start region acting as a start point and separate the plurality of portions of the object from each other, with such expanding thereby providing at least one manufactured semiconductor device on a cut portion of the object that is separate from the other cut portions of the object.

A method of manufacturing a semiconductor device formed using a laser processing method for cutting a flat object to be processed including a semiconductor substrate and a laminate part disposed on the semiconductor substrate, the manufacturing method comprising:

• attaching a protective film to a front face of the object on the laminate part side, irradiating the object, the object having a surface formed with at least one semiconductor device, with laser light while employing a rear face of the object as laser light entrance surface and locating a light-converging point within the semiconductor substrate so as to form a molten processed region, causing the molten processed region to form a cutting start region inside by a predetermined distance from the laser light entrance surface along a line along which the object is intended to be cut, attaching an expandable film to the rear face of the object, and expanding the expandable film so as to separate a plurality of portions produced upon cutting the object from the cutting start region acting as a start point from each other, with such expanding thereby providing at least one manufactured semiconductor device on a cut portion of the object that is separate from the other cut portions of the object.

A method of manufacturing a semiconductor device formed using a laser processing method for cutting a flat object to be processed including a semiconductor substrate and a laminate part disposed on the semiconductor substrate, the manufacturing method comprising:

• attaching a protective film to a front face of the object on the laminate part side, irradiating the object, the object having a surface formed with at least one semiconductor device, with laser light while employing a rear face of the object as a laser light entrance surface and locating a light-converging point within the semiconductor substrate so as to form a molten processed region, causing the molten processed region to form a cutting start region inside by a predetermined distance from the laser light entrance surface along a line along which the object is intended to be cut, attaching an expandable film to the rear face of the object, applying an external force to the object so as to cut the object into a plurality of portions from the cutting start region acting as a start point, and expanding the expandable film so as to separate the plurality of portions of the object from each other, with such expanding thereby providing at least one manufactured semiconductor device on a cut portion of the object that is separate from the other cut portions of the object.

A method of manufacturing a semiconductor device formed using a laser processing method for cutting a flat object to be processed including a semiconductor substrate and a laminate part disposed on the semiconductor substrate, the manufacturing method comprising:

• attaching a protective film to a front face of the object on the laminate part side, irradiating the object, the object having a surface formed with at least one semiconductor device, with laser light while employing a rear face of the as a laser light entrance surface and locating a light-converging point within the semiconductor substrate so as to form a molten processed region, causing the molten processed region to form a cutting start region inside by a predetermined distance from the laser light entrance surface along a line along which the object is intended to be cut, attaching an expandable film to the rear face of the object, and expanding the expandable film so as to cut the object into plurality of portions from the cutting start region acting as a start point and separate the plurality of portions of the object from each other, with such expanding thereby providing at least one manufactured semiconductor device on a cut portion of the object that is separate from the other cut portions of the object.