# US 2007/0145026 A1 · Laser processing apparatus and laser processing method as well as debris extraction mechanism and debris extraction method > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2007/0145026 A1 - Document ID: US20070145026A1 - Status: Published application - Kind: A1 - Application number: 11/467,388 - Filed: 2006-08-25 - Published: 2007-06-28 - Earliest claimed: 2005-12-22 - Assignees: Sony Corporation; Exitech Limited - Inventors: Hidehisa Murase; Yoshinari Sasaki; Kosei Aso; Naoki Yamada - Web page: https://patentgrep.com/patent/US20070145026A1 ## CPC - B23K 26/16: Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece (by a fluid stream B23K26/142) - B23K 26/1462: {Nozzles; Features related to nozzles} - B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM ## Abstract A laser processing apparatus is provided. The laser processing apparatus is for performing pattern processing of a transparent conductive film that is formed on a multilayer film on a substrate by using laser light, includes debris extraction module having a vortex generation mechanism that generates a vortex flow by directing gas into the vicinity of a laser-irradiated portion of the transparent conductive film. The debris extraction module is disposed close to the substrate, and debris before deposition and after deposition on the substrate, which is generated by laser irradiation, is entrapped into the vortex flow to be extracted to the outside with the gas. ## Claims ### Claim 1 A laser processing apparatus for performing pattern processing of a transparent conductive film that is formed on a multilayer film on a substrate by using laser light, comprising: debris extraction means having a vortex generation mechanism that generates a vortex flow by directing gas into the vicinity of a laser-irradiated portion of said transparent conductive film, wherein the debris extraction means is proximal to the substrate and functions to remove laser irradiation generated debris by entrapping pre-deposited and post-deposited debris in to the vortex flow to be extracted to the outside with said gas. ### Claim 2 (depends on 1) A laser processing apparatus according to claim 1, wherein said debris extraction means includes a vortex flow outlet portion provided with a transmission hole being an optical path of the laser light as well as being a flow path of the vortex flow leading to an outlet hole and a vortex-forming portion disposed facing said substrate; wherein said vortex-forming portion includes a vortex-forming plate in which radial vortex-forming grooves corresponding to a rotational direction of said vortex flow and being continuous with said transmission hole are formed in a surface of said vortex-forming portion facing the substrate; and wherein gas is brought into the vortex-forming grooves of said vortex-forming plate to form the vortex flow, and is discharged from said outlet hole to the outside through the transmission hole of said vortex flow outlet portion. ### Claim 3 (depends on 2) A laser processing apparatus according to claim 2, wherein each of said vortex-forming grooves is formed to have an acute angle on the leeward side of said vortex flow with respect to angles formed by the vortex-forming groove and a line tangent to a concentric circle with said transmission hole. ### Claim 4 (depends on 2) A laser processing apparatus according to claim 2, wherein a circular groove continuous with said vortex-forming grooves is provided on an outer circumference side in the surface of said vortex-forming plate facing said substrate; and wherein gas is brought in from gas supply holes formed in said circular groove so that the gas is supplied to said vortex-forming grooves and a gas flow in the same rotational direction as said vortex flow is generated inside said circular groove. ### Claim 5 (depends on 4) A laser processing apparatus according to claim 4, wherein gas inlet portions for directing gas into the gas supply holes formed in said circular groove are provided; and wherein said gas inlet portions are disposed corresponding to disposition of said vortex-forming grooves, being inclined to the windward side in the rotational direction of the vortex flow generated with respect to straight lines connecting the center of said transmission hole and the gas supply holes of said circular groove. ### Claim 6 (depends on 2) A laser processing apparatus according to claim 2, wherein in said vortex-forming plate a groove width of said vortex-forming groove on the side of said circular groove is larger by a predetermined ratio than a groove width of the vortex-forming groove on the side of said transmission hole. ### Claim 7 (depends on 6) A laser processing apparatus according to claim 6, wherein W1:W2 ranges from about 1:1.5 to about 2.5, where W1 is the groove width of said vortex-forming groove formed in said vortex-forming plate on the side of said transmission hole and W2 is the groove width of the same on the side of said circular groove. ### Claim 8 (depends on 2) A laser processing apparatus according to claim 2, wherein a space for generating a circular flow is provided between said transmission hole in said vortex flow outlet portion and the vortex-forming grooves in said vortex-forming plate. ### Claim 9 (depends on 8) A laser processing apparatus according to claim 8, wherein a curved shape or tapered shape is formed in a wall surface around an opening portion of said transmission hole continuous with said space for forming the circular flow. ### Claim 10 A laser processing method of performing pattern processing of a transparent conductive film that is formed on a multilayer film on a substrate by using laser light, comprising: generating a vortex flow by directing gas into the vicinity of a laser-irradiated portion of said transparent conductive film using a debris extraction module having a vortex generation mechanism disposed in proximity to said substrate and extracting laser irradiation generated debris prior to deposition and after deposition on said substrate, by entrapping said debris into said vortex flow to be extracted to the outside with said gas. ### Claim 11 A debris extraction mechanism for removing debris generated by laser irradiation when performing pattern processing of a transparent conductive film that is formed on a multilayer film on a substrate by using laser light, comprising: a vortex generation portion for generating a vortex flow by flowing gas into the vicinity of a laser-irradiated portion of said transparent conductive film, wherein debris deposited on said substrate and suspended debris is entrapped into said vortex flow by said vortex generation portion disposed in proximity to said substrate to be extracted to the outside with said gas. ### Claim 12 A debris extraction method of removing debris generated by laser irradiation when performing pattern processing of a transparent conductive film that is formed on a multilayer film on a substrate by using laser light, comprising: generating a vortex flow by directing gas into the vicinity of a laser-irradiated portion of said transparent conductive film using a vortex generation portion disposed in proximity to said substrate and extracting debris deposited on said substrate and suspended debris by entrapping said debris into said vortex flow to be extracted to the outside with said gas. ### Claim 13 A laser processing apparatus for performing pattern processing of a transparent conductive film that is formed on a multilayer film on a substrate by using laser light, comprising: a debris extraction module having a vortex generation mechanism that generates a vortex flow by directing gas into the vicinity of a laser-irradiated portion of said transparent conductive film, wherein said debris extraction module is disposed in proximity to said substrate, and debris deposited on said substrate and suspended debris is entrapped into said vortex flow to be extracted to the outside with said gas.