Pixel detector and method of manufacture and assembly thereof
AssigneeInteron Corporation
InventorEinar Nygard
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AssigneeInteron Corporation
InventorEinar Nygard
Estimating the term…
A detector assembly (50) is formed by integrating the electronic processing circuits on a CMOS wafer by stitching a plurality of reticles of at least two different types so as to form an integrated circuit having an array of electronic processing circuits each having a respective sensor input disposed toward a first surface of the wafer and accessible from the first surface via a contact formed near an edge of the integrated circuit. Sensor elements (56) are disposed on the first surface of the respective integrated circuits in the detector whereby an exposed surface of the sensor elements forms a common first electrode towards which incident photons are directed, and an opposite unexposed surface thereof forms multiple second electrodes of opposite polarity to the first electrode each in registration with a corresponding sensor input.
A method for fabricating a detector (50) having a plurality of pixels (13) each including a sensor element (14) coupled to a sensor input of an electronic processing circuit (16), the method comprising:
A detector assembly (50) having a plurality of pixels that include a sensor element coupled to a sensor input of an electronic processing circuit, the detector assembly comprising:
Dependencies are inferred from the claim text.