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AssigneeMitsui Mining & Smelting Co., Ltd.
InventorsTatsuo Kataoka, Yoshikazu Akashi, Yutaka Iguchi
Estimating the term…
[Solution means] A process for producing a printed wiring board comprises the steps of depositing a base metal on at least one surface of an insulating film to form a base metal layer and further depositing copper or a copper alloy to form a conductive metal layer, then removing a surface metal layer, which is formed through the above step, by etching to form a wiring pattern, and then treating the base metal layer with a treating liquid capable of dissolving and/or passivating the metal that forms the base metal layer. The printed wiring board so provided comprises an insulating film and a wiring pattern formed on at least one surface of the insulating film, the wiring pattern including a base metal layer deposited on the insulating film surface and a conductive metal layer, the base metal layer for forming the wiring pattern protrudes in a widthwise direction more than the conductive metal layer for forming the wiring pattern.
A process for producing a printed wiring board, comprising a step of depositing a base metal on at least one surface of an insulating film to form a base metal layer and depositing copper or a copper alloy on a surface of the base metal layer to form a conductive metal layer and a step of selectively removing a metal layer of a base film, which is formed through the above step, by etching to form a wiring pattern, wherein:
A printed wiring board comprising an insulating film and a wiring pattern formed on at least one surface of the insulating film, said wiring pattern comprising a base metal layer formed on the insulating film surface and a conductive metal layer formed on a surface of the base metal layer, said base metal layer for forming the wiring pattern being protruded widthwise more than the conductive metal layer for forming the wiring pattern.
Dependencies are inferred from the claim text.