Highly compliant bonding compound and structure

Abstract

A compliant bonding material includes a thixotropic filler, and a plurality of nanoparticles embedded in the filler. The filler can be for example, oil or other stable viscous liquid with the proper surface tension properties, for example, siloxane, other silicone oils, or polysiloxane. The nanoparticles can be, e.g., Ag, Cu, Ti, Ni, metal oxides, silica, ZnO and Fe2O3. A plurality of microspheres can be embedded in the filler, with whiskers formed on surfaces of the microspheres. Nanoparticles can also be embedded in the filler. The whiskers can be nanotubes, nanoparticles and/or nanowires. The whiskers can be, for example, metallic. The bonding material can be used a bonded structure that includes a first surface and a second surface, with the bonding material positioned between the first and second surfaces.

Dependencies are inferred from the claim text.