Group encapsulated dicing chuck
OwnerWarren Farnworth, Tom Muntiferinginventors
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Abstract
A semiconductor wafer saw and method of using the same for dicing semiconductor wafers are disclosed comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.
Claims48
In combination, a semiconductor substrate singulation saw and a chuck for holding a semiconductor substrate comprising:
- a saw having at least one blade supported above a table and oriented to cut mutually parallel paths in the surface of a semiconductor substrate positioned on the table;
- and
- a chuck having at least one cutting pedestal located thereon mounted on the table, the chuck for holding the semiconductor substrate during the cutting thereof by the saw.
In combination, a semiconductor substrate singulation saw and a table for mounting a semiconductor substrate comprising:
- a saw having at least two blades supported above a table and oriented to cut mutually parallel paths in the surface of a semiconductor substrate positioned on the table;
- and
- a chuck having at least one cutting pedestal located thereon mounted on the table, the chuck for holding the semiconductor substrate during the cutting thereof by the saw.
An apparatus for singulation of a semiconductor substrate comprising:
- a saw having at least one blade supported above a table and oriented to cut mutually parallel paths in the surface of a semiconductor substrate positioned on the table;
- and
- a chuck having at least one cutting pedestal located thereon mounted on the table, the chuck for holding the semiconductor substrate during the cutting thereof by the saw.
An apparatus for the singulation of a semiconductor substrate comprising:
- a saw having at least two blades supported above a table and oriented to cut mutually parallel paths in the surface of a semiconductor substrate positioned on the table;
- and
- a chuck having at least one cutting pedestal located thereon mounted on the table, the chuck for holding the semiconductor substrate during the cutting thereof by the saw.
Dependencies are inferred from the claim text.