Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
AssigneeMircon Technology, Inc.
InventorJames Wark
Life of this patent
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Abstract
An inventive electronic device, such as a multi-chip module (MCM), a Single In-line Memory Module (SIMM), or a Dual In-line Memory Module (DIMM), includes a base, such as a printed circuit board, having a surface on which flip-chip pads and wire-bondable pads are provided. The flip-chip pads define an area on the surface of the base at least partially bounded by the wire-bondable pads. A first integrated circuit (IC) die is flip-chip bonded to the flip-chip pads, and a second IC die is back-side attached to the first IC die and then wire-bonded to the wire-bondable pads. As a result, the flip-chip mounted first IC die is stacked with the second IC die in a simple, novel manner.
Claims15
An electronic system comprising an input device, an output device, a memory device, and a processor device coupled to the input device, the output device, and the memory devices, one of the input device, the output device, the memory device, and processor device comprising:
- a base having a surface having a first plurality of flip-chip pads thereon and a second plurality of wire-bondable pads thereon, the first plurality of flip-chip pads connected to the second plurality of wire-bondable pads;
- a first integrated circuit die having opposing front-side and back-side surfaces, the front-side surface having a plurality of flip-chip bumps thereon, at least one flip-chip bump of the plurality of flip-chip bumps connected to at least one flip-chip pad of the first plurality of flip-chip pads on the surface of the base;
- a second integrated circuit die having opposing front-side and back-side surfaces, the back-side surface attached to the back-side surface of the first integrated circuit die and the front-side surface having a plurality of bond pads thereon;
- and
- at least one wire connection between at least one bond pad of the plurality of bond pads on the front-side surface of the second integrated circuit die and at least one wire-bondable pad of the second plurality of wire-bondable pads on the surface of the base.
An electronic system comprising an input device, an output device, a memory device, and a processor device coupled to the input, output, and memory devices, one of the input, output, memory, and processor devices comprising a base having a surface for carrying integrated circuit dice, the base comprising:
- a plurality of flip-chip pads arranged in a pattern on the surface of the base defining an area thereon, the flip-chip pads being flip-chip connectable to flip-chip bumps on a first integrated circuit die carryable on the surface;
- and
- a plurality of wire-bondable pads interconnected with the flip-chip pads and arranged in a pattern on the surface of the base such that the wire-bondable pads as a group electrically mirror the flip-chip pads as a group, the wire-bondable pads at least partially bounding the area on the surface defined by the pattern of flip-chip pads and being wire-bondable to bond pads on a second integrated circuit die carryable on the first integrated circuit die.
An electronic device comprising:
- a printed circuit board having a surface having a first plurality of flip-chip pads thereon and a second plurality of wire-bondable pads thereon, at least one flip-chip pad of the first plurality of flip-chip pads connected to at least one wire bondable pad of the second plurality of wire-bondable pads on the surface of the printed circuit board;
- a first integrated circuit die having opposing front-side and back-side surfaces, the front-side surface having a plurality of flip-chip bumps thereon and at least one flip-chip bump of the plurality of flip-chip bumps connected to at least one flip-chip pad of the first plurality of flip-chip pads on the surface of the base;
- a second integrated circuit die having opposing front-side and back-side surfaces, the back-side surface of the second integrated circuit die attached to the back-side surface of the first integrated circuit die and the front-side surface of the second integrated circuit die having a plurality of bond pads thereon;
- and
- at least one wire connection between at least one bond pad of the plurality of bond pads on the front-side surface of the second integrated circuit die and the at least one wire-bondable pad of the second plurality of wire-bondable pads on the surface of the base.
Dependencies are inferred from the claim text.