Substrate cleaning system and substrate cleaning method
AssigneeSPC Electronics Corporation
InventorsTakehiro Hagiwara, Tatsuo Kataoka, Seiji Noda, Takafumi Nakai
Life of this patent
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Abstract
A substrate cleaning system that cleans a glass substrate by supplying liquid and gas to spray nozzles and by spraying fluid, where the liquid and the gas are mixed in the spray nozzles, onto the substrate in order to effectively remove foreign objects attached on the end surface of substrate after performing mechanical cut-off or polishing treatment, the system has: liquid heating means for heating the liquid to be supplied to the spray nozzles to control the temperature of the liquid, in which the temperature of the liquid at the inlet of the spray nozzles is controlled at 40° C. to 100° C.
Claims19
A substrate cleaning system that cleans a glass substrate by supplying liquid and gas to spray nozzles and by spraying fluid, where said liquid and said gas are mixed in said spray nozzles, onto the end surface of said substrate, said system comprising:
- liquid heating means for heating the liquid to be supplied to the spray nozzles to control the temperature of said liquid, wherein
- the temperature of said liquid at the inlet of said spray nozzles is controlled at 40° C. to 100° C.
A substrate cleaning system that cleans a substrate by fluid sprayed from spray nozzles, said system comprising:
- spray nozzles disposed near the substrate;
- and
- vapor generating means for generating vapor and supplying the vapor to said spray nozzles, wherein
- said spray nozzles spray the vapor supplied from said vapor generating means onto the substrate.
A substrate cleaning method that cleans a substrate by supplying liquid and gas to spray nozzles and by spraying fluid, where said liquid and said gas are mixed in said spray nozzles, onto said substrate, wherein
- the liquid to be supplied to the spray nozzles is heated and the temperature of said liquid is controlled to 40° C. to 100° C.
A substrate cleaning method that cleans a substrate by fluid sprayed from spray nozzles, wherein
- vapor is supplied to the spray nozzles, and the vapor supplied from said spray nozzles is sprayed onto the substrate.
Dependencies are inferred from the claim text.