# US 2007/0004316 A1 · Integrated system for processing semiconductor wafers

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- Number: US 2007/0004316 A1
- Document ID: US20070004316A1
- Status: Published application
- Kind: A1
- Application number: 11/452,609
- Filed: 2006-06-13
- Published: 2007-01-04
- Earliest claimed: 2001-01-05
- Inventors: Jalal Ashjaee; Boris Govzman; Bernard Frey; Boguslaw Nagorski; Douglas Young; Bulent Basol; Homayoun Talieh
- Web page: https://patentgrep.com/patent/US20070004316A1

## CPC

- H10P 72/3304: {characterised by movements or sequence of movements of transfer devices}
- B24B 37/345: {Feeding, loading or unloading work specially adapted to lapping}
- G05B 19/41865: {characterised by job scheduling, process planning, material flow}
- H10P 72/0406: {for cleaning followed by drying, rinsing, stripping, blasting or the like}
- H10P 72/0408: {for drying}
- H10P 72/0412: {using mainly scrubbing means, e.g. brushes}
- H10P 72/0414: {using mainly spraying means, e.g. nozzles}
- H10P 72/0456: {in-line arrangement}
- H10P 72/0472: {comprising at least one polishing chamber}
- H10P 72/7602: {the wafers being placed on a robot blade or gripped by a gripper for conveyance}
- H10P 72/7608: {characterised by a plurality of separate clamping members, e.g. clamping fingers}
- G05B 2219/32272: Decision of next visiting machine selection, where job is to go
- G05B 2219/45031: Manufacturing semiconductor wafers
- Y02P 90/02: Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- B24B: MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING (grinding of gear teeth B23F, of screw-threads B23G1/36; by electro-erosion B23H; abrasive or related blasting B24C; tools for grinding, buffing or sharpening B24D; polishing compositions C09G1/00; abrasives C09K3/14; electrolytic etching or polishing C25F3/00; grinding arrangements for use on assembled railway tracks E01B31/17); DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- G05B: CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS (systems for controlling or regulating non-electric variables G05D; systems for regulating electric or magnetic variables G05F; control devices or systems insofar as characterised by mechanical features only G05G)
- Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS

## Abstract

An integrated process tool for chemical mechanical processing, cleaning and drying a semiconductor workpiece is provided. The integrated process tool includes a CMP module and a cleaning and drying module. After being processed, the workpiece is transported from the CMP module to the cleaning and drying module using a movable housing. In the cleaning and drying module, a cleaning mechanism is used to clean the workpiece while the workpiece is rotated and held by a support stucture of the movable housing. A drying mechanism of the cleaning and drying module picks up the workpiece from the moveable housing and spin dries it. Throughout the CMP process, cleaning and drying, the processed surface of the wafer faces down.

## Claims

### Claim 1

An integrated wafer processing system for processing a plurality of wafers comprising:
at least one electrochemical mechanical polishing (ECMP) station to remove material from a front surface of each of the plurality of wafers;
at least one chemical mechanical polishing station that contains separate wafer entry and wafer exit points; and
a wafer-handling subsystem for transporting each of the plurality of wafers into and out of the at least one electrochemical mechanical polishing station and the at least one chemical mechanical polishing station.

### Claim 2 (depends on 1)

The system of claim 1, wherein each of the stations is disposed in a cluster arrangement adjacent the wafer-handling subsystem.

### Claim 3 (depends on 1)

The system of claim 1, wherein the wafer-handling subsystem includes at least one wafer-handling robot.

### Claim 4 (depends on 1)

The system of claim 1, wherein the wafer-handling subsystem comprises:
a first wafer handling robot for removing each of the plurality of wafers from a cassette and placing the wafer in a buffer, and removing each of the plurality of wafers from the buffer and replacing the wafer in the cassette; and
a second wafer handling robot for removing each of the plurality of wafers from the buffer and placing the wafer in one of the stations, and removing each of the plurality of wafers from the station and replacing the wafer in the buffer.

### Claim 5

An integrated wafer processing system for processing a plurality of wafers comprising:
at least one electrochemical deposition station to deposit metal onto surfaces of the plurality of wafers in sequence;
at least one electrochemical mechanical polishing (ECMP) station for removing metal from surfaces of the plurality of wafers;
an annealing station;
at least one chemical mechanical polishing station that contains separate wafer entry and wafer exit points; and
a wafer-handling subsystem for transporting the plurality wafers into and out of the at least one electrochemical deposition station, the at least one electrochemical mechanical polishing station, the annealing station, and the at least one chemical mechanical polishing station.

### Claim 6 (depends on 5)

The system according to claim 5, wherein the annealing station includes an annealing area and a chilling area.

### Claim 7 (depends on 5)

The system of claim 5, wherein each of the stations is disposed in a cluster arrangement adjacent the wafer-handling subsystem.