Semiconductor laser element
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorTadashi Takase
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AssigneeMitsubishi Denki Kabushiki Kaisha
InventorTadashi Takase
Estimating the term…
A method of producing a semiconductor laser element including, growing a lower cladding layer, an active layer, a first left upper cladding layer, a first etching stopper layer, a second left upper cladding layer, a second etching stopper layer, an upper cladding layer and a contact layer in the order on a semiconductor substrate to form a laminate structure, doping an impurity end portions near to edge surfaces of the laminate structure so as to cross over the active layer to form window regions, etching the contact layer in the window regions, forming a protective film to form a ridge, etching both sides of the protective film with the protective film at a condition which is set to etch the window regions up to a middle of the second left cladding layer and to etch the other region up to a middle of the upper cladding layer a step of wet etching the window regions up to the first etching stopper layer and the other region up to the second etching stopper layer.
A method of producing a semiconductor laser element comprising:
A method of producing a semiconductor laser element comprising:
A method of producing a semiconductor laser element comprising:
Dependencies are inferred from the claim text.