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US 2006/0292740 A1Published application
High Temperature Packaging for Electronic Components, Modules and Assemblies
AssigneeSolid State Devices, Inc.
InventorEdward Applebaum
Life of this patent
Estimating the term…
Abstract
A high temperature semiconductor packaging, a method for making the same packaging are providing. The packaging comprises a mounting platform, a semiconductor die positioned above the platform and a layer of high temperature passivation coating.
Claims16
A high temperature semiconductor packaging, comprising:
- a mounting platform;
- a semiconductor die positioned above the mounting platform;
- and
- a layer of high temperature passivation coating.
1 more element
A method of making a high temperature semiconductor packaging, the method comprising:
- providing a mounting plate having a semiconductor die;
- applying a high temperature passivation coating;
- and
- curing the high temperature passivation coating.
1 more element
Dependencies are inferred from the claim text.