Bonding of target tiles to backing plate with patterned bonding agent
AssigneeApplied Materials, Inc.
InventorsHien-Minh Le, Akihiro Hosokawa
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Abstract
A target assembly including a plurality of target tiles bonded to a backing plate by adhesive, for example of indium or conductive polymer, filled into recesses in the backing plate formed beneath each of the target tiles. A sole peripheral recess formed as a rectangular close band may be formed inside the tile periphery. Additional recesses may be formed inside the peripheral recess, preferably symmetrically arranged about perpendicular bisectors of rectangular tiles. The depth and width of the recesses may be varied to control the amount of stress and the stress direction.
Claims18
A sputtering target assembly, comprising:
- a backing plate;
- and
- at least one target tile bonded to said backing plate in a respective tile area thereof;
- wherein said backing plate is formed with at least one predetermined recess in each of said tile areas filled with said adhesive.
A method of sputtering a target material onto a substrate, comprising the steps of:
- providing in a sputter reactor a target having at least one target tile comprising said target material bonded to a backing plate, wherein said backing plate includes at least one groove formed therein adjacent a respective one of said at least one target tile and filled with an adhesive;
- disposing a substrate in said sputter reactor;
- and
- creating a plasma of a working gas in said sputter reactor to sputter said target material from said at least one target tile onto said substrate.
Dependencies are inferred from the claim text.