Molding die apparatus, method for disc substrate, and disc-shaped recording medium
AssigneeSony Corporation
InventorYoshihito Fukushima
Life of this patent
Estimating the term…
Abstract
Preventing a molded disc substrate from generating a separation pattern. To this end, a molding die 1 includes a pair of stationary die 6 and movable die 7, and an outer circumference ring 16 for molding an outer circumference end of the disc substrate 2. The outer circumference ring 16 is so mounted as to be movable along forward and backward directions in parallel with a moving direction of the movable die 7 toward the stationary die 6, and has a retaining surface 39 for retaining the outer circumference of the molded disc substrate 2.
Claims3
1-4. (canceled)
A disc-shaped recording medium which has a retaining surface being of a continuous or discontinuous ring-shaped surface around the outer circumference thereof which is formed by an outer circumference ring of a molding die apparatus for molding an outer circumference end of a disc substrate, and is retained by the outer circumference ring.
Dependencies are inferred from the claim text.