Electro-optical panel, sealing member, electro-optical panel manufacturing method, self-emission panel, self-emission panel manufacturing method, and sealing member for use in self-emission panel

A method of manufacturing an electro-optical panel including a sealing area having an electro-optical functional section between a pair of mutually facing members, wherein

• one of the mutually facing members comprises a support substrate having a lead-out area containing an area for forming lead-out wiring extending from the sealing area and for connecting or mounting drive means to the lead-out wiring,
• the other of the mutually facing members has protruding reinforcement section(s) protruding from the sealing area on to the lead-out area,
• wherein
• an adhesive layer surrounding the sealing area is formed on one or both of the mutually facing members, and the pair of said mutually facing members are bonded together through the adhesive layer.

A self-emission panel comprising:

• a mother support substrate having formed thereon a plurality of self-emission sections;
• a mother sealing member having arranged thereon a plurality of sealing sections corresponding to the plurality of self-emission sections, and
• sealing areas formed by bonding together the mother support substrate and the mother sealing member for sealing the plurality of self-emission sections, with said plurality of self-emission sections corresponding to said plurality of sealing sections,
• wherein the mother support substrate includes lead-out areas having formed thereon lead-out wiring portions extending from the plurality of self-emission sections to the outsides of the sealing areas,
• wherein the mother sealing member has hole processing portions for exposing the lead-out wiring portions.

A method of manufacturing self-emission panels, said method comprising the steps of:

• forming a plurality of self-emission sections on a mother support substrate;
• forming on a mother sealing member hole processing potions corresponding to lead-out wiring portions of the plurality of self-emission sections;
• bonding together the mother support substrate and the mother sealing member to expose the lead-out wiring portions from the hole processing portions, and sealing the plurality of self-emission sections within sealing areas corresponding to sealing sections of the mother sealing member;
• examining the plurality of self-emission sections by connecting inspection terminals to the lead-out wiring portions exposed from the hole processing portions;
• cutting and dividing the mother support substrate and the mother sealing member into unit panels having said sealing areas and said lead-out wiring portions.