Electron emission display device having a cooling device and the fabricating method thereof
OwnerByong Leeinventor
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Abstract
An electron emission display device having internal cooling and a fabricating method of the device. The electron emission display device of the present invention comprises at least one first electrode pad provided on a substrate, at least one second electrode pad provided symmetrically to the first electrode pad with respect to a line along which the first electrode pad is located, and at a predetermined distance from this line, a first semiconductor formed so that one end of the first electrode pad and one end of the second electrode pad can be electrically connected to each other, and a second semiconductor formed at the other end of the first electrode pad. The durability of the device is enhanced by directly cooling the electron emitting portion.
Claims20
An electron emission display device having internal cooling, comprising:
- at least one first electrode pad provided on a substrate and located along a first line;
- at least one second electrode pad provided on the substrate symmetrically to the at least one first electrode pad with respect to the first line and located at a distance from the first line;
- a first semiconductor formed on the substrate and electrically connecting one end of the at least one first electrode pad to one end of the at least one second electrode pad;
- and
- a second semiconductor formed on the substrate and electrically connected to the other end of the first electrode pad.
A method for fabricating an electron emission display device having a cooling device, the method comprising:
- forming a first electrode pad and a second electrode pad on a substrate by etching electrically conductive materials on the substrate;
- and
- forming a first semiconductor and a second semiconductor, at least one of the first semiconductor or the second semiconductor electrically connecting the first electrode pad to the second electrode pad.
An electron emission display device having internal cooling, comprising:
- first electrode pads located on a substrate at predetermined intervals along a first direction, the first electrode pads each having two ends;
- second electrode pads located on the substrate at predetermined intervals along the first direction, the second electrode pads each having two ends;
- first semiconductors formed on the substrate connecting one end of each one of the first electrode pads to one end of an adjacent one of the second electrode pads;
- and
- second semiconductors formed on the substrate connecting the other end of each one of the first electrode pads to one end of another adjacent one of the second electrode pads,
- wherein the first electrode pads are formed from a first conductive material and the second electrode pads are formed from a second conductive material different from the first conductive material.
Dependencies are inferred from the claim text.