Folded interposer

A high density semiconductor package having at least two semiconductor dice comprising:

• a substrate having at least one contact pad on a surface thereof;
• and
• a flexible interposer folded around a first semiconductor die of the at least two semiconductor dice, the interposer including a first surface having a plurality of electrical contacts for electrically connecting the first semiconductor die to the substrate, a second surface, and a plurality of vias extending through the interposer from the first surface to the second surface, the first semiconductor die having a plurality of bond pads on a surface thereof and a back surface, the first semiconductor die positioned in a back-to-back configuration with another semiconductor die of the at least two semiconductor dice and attached to the interposer to form an intermediate packaging structure;
• at least one electrical contact of the plurality of electrical contacts of the flexible interposer connected to the at least one contact pad of the substrate.

An interposer comprising:

• a thin, flexible material comprised of a first surface and a second surface, the material for folding around at least one semiconductor die, the material having substantially the same width as the at least one semiconductor die;
• a plurality of vias extending from the first surface to the second surface;
• and
• a plurality of electrical contacts on the first surface of the material.