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US 2006/0242468 A1Published application
Memory application tester having vertically-mounted motherboard
AssigneeUniTest Incorporation
InventorJong Kang
Life of this patent
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Abstract
The present invention relates to a memory application tester for testing a semiconductor memory device comprising a plurality of motherboards having a memory socket. The motherboards are vertically mounted and effectively integrated so that a memory application tester may test more memory device simultaneously, and a limit in the trace length due to the integration of the motherboards is effectively solved.
Claims14
A memory application tester for testing a semiconductor memory device using motherboards, the tester comprising:
- a plurality of the motherboards having a memory socket, the plurality of the motherboards being vertically mounted;
- an interface board disposed above the each of the motherboards, the interface board including a test socket disposed thereon for inserting the semiconductor memory device, and a high-speed connector disposed thereunder being electrically connected to the test socket;
- and
- a HiFix board disposed vertically to be in parallel to each of the motherboards, wherein the HiFix board includes a connector for connecting to the memory socket of the motherboard and a socket electrically connected to the connector, wherein the high-speed connector of the interface board is inserted in the socket.
1 more element
Dependencies are inferred from the claim text.