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US 2006/0235137 A1Published application
Die attach adhesives with improved stress performance
OwnerEunsook Chaeinventor
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Abstract
Adhesive compositions containing a base compound or resin and an epoxy resin with vinyl functionality, without a curing agent for the epoxy resin, show enhanced stress performance. The compositions can be used in microelectronic applications.
Claims4
A die attach adhesive composition comprising:
- (a) a resin capable of curing by free-radical polymerization or by hydrosilation, present in an amount of 10% to 80% by weight,
- (b) an epoxy compound having vinyl or allyl functionality, present in an amount of 0.1% to 30% by weight,
- (c) a curing agent for the resin (a), present in an amount of 0.1% to 10% by weight, and
- (d) optionally, a filler, present in an amount of 20% to 90% by weight;
- characterized in that there is no curing agent for the epoxy compound present.
2 more elements
Dependencies are inferred from the claim text.