US 2006/0234888 A1 · Acidic chemistry for Post-CMP cleaning

Abstract

This disclosure discusses cleaning of semiconductor wafers after the Chemical-Mechanical Planarization (CMP) of the wafer during the manufacturing of semiconductor devices. Disclosed is an acidic chemistry for the post-CMP cleaning of wafers containing metal, particularly copper, interconnects. Residual slurry particles, particularly copper or other metal particles, are removed from the wafer surface without significantly etching the metal, leaving deposits on the surface, or imparting significant organic (such as carbon) contamination to the wafer while also protecting the metal from oxidation and corrosion. Additionally, at least one strong chelating agent is present to complex metal ions in solution, facilitating the removal of metal from the dielectric and preventing re-deposition onto the wafer. Using acidic chemistry, it is possible to match the pH of the cleaning solution used after CMP to that of the last slurry used on the wafer surface.

Claims24

Dependent claims

A composition for cleaning a semiconductor work-piece, the composition comprising:

(a) a cleaning agent, wherein said cleaning agent is selected from the group consisting of:
(i) ammonium citrate;
(ii) ammonium oxalate;
(iii) aspartic acid;
(iv) benzoic acid;
(v) citric acid;
(vi) cysteine;
(vii) glycine;
(viii) gluconic acid;
(ix) glutamic acid;
(x) histidine;
(xi) maleic acid;
(xii) oxalic acid;
(xiii) propionic acid;
(xiv) salicylic acid;
(xv) tartaric acid;
(xvi) and mixtures thereof;
and
(b) a corrosion-inhibiting compound, wherein said corrosion-inhibiting compound is selected from the group consisting of:
(i) ascorbic acid;
(ii) benzotriazole;
(iii) caffeic acid;
(iv) cinnamic acid;
(v) cysteine;
(vi) glucose;
(vii) imidazole;
(viii) mercaptothiazoline;
(ix) mercaptoethanol;
(x) mercaptopropionic acid;
(xi) mercaptobenzothiazole;
(xii) mercaptomethylimidazole;
(xiii) tannic acid;
(xiv) thioglycerol;
(xv) thiosalicylic acid;
(xvi) triazole;
(xvii) vanillin;
(xviii) vanillic acid;
(xix) and mixtures thereof.

35 more elements

Dependencies are inferred from the claim text.

Acidic chemistry for Post-CMP cleaning

Life of this patent

Acidic chemistry for Post-CMP cleaning

Life of this patent

Abstract

Claims24