Modular sockets using flexible interconnects

Apparatus for connecting a semiconductor die having a plurality of bond pads on at least one surface thereof and a substrate comprising:

• two plates each having a first side, a second side, a first end, and a second end, the first side of a first plate located adjacent the second side of a second plate for forming a die socket having a die slot at a first end thereof and a lead slot at a second end thereof;
• a tape including conductive leads formed on a portion of an insulation film having at least one conductive lead having an inner end for resiliently contacting at least one bond pad of the bare semiconductor die and having an outer end for contacting a portion of the substrate;
• biasing apparatus for engaging the inner end of the at least one conductive lead into resilient contact with the at least one bond pad of the bare semiconductor die;
• and
• a third plate located adjacent one of the first plate and the second plate for forming a second die socket.

A vertical connector for connecting a semiconductor die having a plurality of bond pads on at least one surface thereof and a substrate comprising:

• two plates each having a first side, a second side, a first end, and a second end, the first side of a first plate located adjacent the second side of a second plate for forming a die socket having a die slot at a first end thereof and having a lead slot at a second end thereof;
• a tape including at least one lead formed on a portion of a film having an inner end for resilient electrical contact with the plurality of bond pads of one of the bare semiconductor die and an outer end for contacting a substrate;
• apparatus for engaging the inner end of the at least one conductive lead into resilient contact with the at least one bond pad of the semiconductor die;
• and
• a third plate located adjacent one of the first plate and the second plate for forming a second die socket.

A method of forming a module for the insertion of semiconductor die thereinto and connecting said semiconductor die to a substrate having conductor thereon, said semiconductor die having a plurality of conductive bond pads on a surface thereof, said method comprising:

• providing a first plate having first and second major sides with corresponding first and second ends;
• providing a second plate having first and second major sides with corresponding first and second ends;
• providing a multi-layer interconnect lead tape including a pattern of electrically conductive leads formed on an insulative film, said conductive leads having inner ends for resilient electrical contact with bond pads of said semiconductor die and outer ends for electrical contact with said conductors on said substrate;
• providing resilient apparatus;
• abutting the second major side of said first plate and the first major side of said second plate thereby forming a bare die socket having a die slot at the first ends of said first plate and said second plate and a lead slot at the second ends of said first plate and said second plate, the first ends of said multi-layer interconnect lead tape extending between the second major side of said first plate and the first major side of said second plate and the second ends of said multi-layer interconnect lead tape extending beyond the second ends of said first plate and said second plated.

A method of forming a module for the insertion of semiconductor die thereinto and connecting said semiconductor die to a substrate having conductor thereon, said semiconductor die having a plurality of conductive bond pads on a surface thereof, said method comprising:

• providing a first plate having first and second major sides with corresponding first and second ends;
• providing a second plate having first and second major sides with corresponding first and second ends;
• providing a multi-layer interconnect lead tape including a pattern of electrically conductive leads formed on an insulative film, said conductive leads having inner ends for resilient electrical contact with bond pads of said semiconductor die and outer ends for electrical contact with said conductors on said substrate;
• providing resilient apparatus;
• abutting the second major side of said first plate and the first major side of said second plate thereby forming a bare die socket having a die slot at the first ends of said first plate and said second plate and a lead slot at the second ends of said first plate and said second plate, the first ends of said multi-layer interconnect lead tape extending between the second major side of said first plate and the first major side of said second plate and the second ends of said multi-layer interconnect lead tape extending beyond the second ends of said first plate and said second plated.

A plate for adapted for abutting an another adjacent plate to form an interconnect socket for a semiconductor die for connection of a substrate, said plate comprising:

• a generally planar member formed of an insulative material, said plate having a first side and a second side, a first end and a second end;
• said second side including a recessed die slot for insertion of a bare die from said first end;
• said first side including a recess for holding an interconnect lead tape for resilient contact with said die and a substrate;
• and
• whereby a second side of one said plate abutted to the first side of said another adjacent plate to forms a module for removable insertion of a semiconductor die for electrical interconnection to said substrate.