Substrate processing method and substrate processing apparatus

A substrate processing apparatus comprising:

• a plating tank for holding a plating solution;
• an anode disposed in the plating solution in the plating tank and opposite a substrate with a plating inhibiting material for inhibiting plating attached to an outermost surface of the substrate surface excluding interior surfaces of recesses;
• and
• a plating power source for applying a predetermined plating voltage between the anode and the substrate.

A plating inhibiting material application apparatus for applying a plating inhibiting material to an outermost surface, which excludes interior surfaces of recesses, of a substrate surface to be plated, comprising:

• a high-vacuum chamber;
• a substrate holder, disposed in the high-vacuum chamber, for fixing the substrate;
• a jet orifice, disposed in the high-vacuum chamber, for jetting the plating inhibiting material;
• and
• a vacuum pump for vacuumizing the high-vacuum chamber.

A plating inhibiting material application apparatus for applying a plating inhibiting material to an outermost surface, which excludes interior surfaces of recesses, of a substrate surface to be plated, comprising:

• a substrate holder for fixing the substrate;
• a stamp for transferring and attaching the plating inhibiting material carried on the stamp to the outermost surface of the substrate by pressing the stamp against the surface of the substrate;
• and
• a press mechanism for pressing the stamp against the surface of the substrate.

A plating inhibiting material application apparatus for applying a plating inhibiting material to an outermost surface, which excludes interior surfaces of recesses, of a substrate surface to be plated, comprising:

• a substrate holder for fixing the substrate;
• a screen;
• a screen frame for fixing the peripheral portion of the screen;
• and
• a squeegee, a tool for applying a pressure, which is to be moved in a direction parallel to the surface of the substrate while holding the plating inhibiting material between it and the screen and applying a pressure on the screen to press it against the surface of the substrate, so that by the pressure the screen is brought into sequential contact with the surface of the substrate and the plating inhibiting material is allowed to permeate the screen and to be attached to the surface of the substrate;
• wherein the screen comprises two layers of a layer having a mesh structure and a layer comprising a porous elastic material, and the layer comprising the porous elastic material is disposed on the side to be brought into contact with the surface of the substrate when the pressure is applied by the squeegee.

A metal vapor deposition apparatus for vapor-depositing a metal onto an outermost surface, which excludes interior surfaces of recesses, of a substrate surface, comprising:

• a high-vacuum chamber;
• a substrate holder, disposed in the high-vacuum chamber, for fixing the substrate;
• a vapor deposition source, disposed in the high-vacuum chamber, for melting a metal placed therein and generating vaporized particles of the metal;
• a heater for heating the metal in the vapor deposition source;
• and
• a vacuum pump for vacuumizing the high-vacuum chamber.

A substrate processing apparatus comprising:

• a liquid application section for applying a liquid containing a dissolved plating inhibiting material to an outermost surface, which excludes interior surfaces of recesses, of a substrate surface;
• a drying section for drying the liquid which has been applied to the substrate in the liquid application section;
• and
• a plating section for carrying out plating of the substrate which has been dried in the drying section.

A substrate processing method comprising:

• applying a liquid containing a dissolved plating inhibiting material to an outermost surface, which excludes interior surfaces of recesses, of a substrate surface;
• drying the liquid applied to the substrate;
• and
• carrying out plating of the surface of the substrate after drying.