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US 2006/0234493 A1Published application
Method of manufacturing a device, device, non-contact type card medium, and electronic equipment
AssigneeSeiko Epson Corporation
InventorTakashi HASHIMOTO
Life of this patent
Estimating the term…
Abstract
Wirings 2B1 are formed by application of heat treatment after an ink jet system is used to discharge a conductive liquid L onto a provisional substrate 5 having a predetermined repellent property, bonding an insulating layer 4B1 to the wirings 2B1 with an adhesive material 3B1 therebetween, peeling and removing the provisional substrate 5, and bonding and fixing the wirings 2B1 together with the insulating film 4B1 to a main substrate 1 by an adhesive material 3B1.
Claims3
A method of manufacturing a device, comprising the steps of:
- (a) forming first wirings on a provisional substrate by means of a droplet discharge method;
- (b) mounting an insulating body on the first wirings to form a laminated body of the first wirings and the insulating body;
- (c) peeling off the laminated body from the provisional substrate;
- and
- (d) mounting the laminated body on a main substrate.
2 more elements
A method of manufacturing a device, comprising the steps of:
- (a) forming first wirings on a provisional substrate;
- (b) mounting an insulating body on the first wirings to form a laminated body of the first wirings and the insulating body;
- (c) forming openings in the insulating body to expose at least a part of the first wirings;
- (d) peeling off the laminated body from the provisional substrate;
- (e) mounting the laminated body on a main substrate;
- and
- (f) forming a conductive layer in the openings by means of a droplet discharge method.
4 more elements
Dependencies are inferred from the claim text.