Increased stand-off height integrated circuit assemblies, systems, and methods
AssigneeTexas Instruments Incorporated
InventorsCharles Odegard, Tz-Cheng Chiu
Life of this patent
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Abstract
Disclosed are integrated circuit assemblies with increased stand-off height and methods and systems for their manufacture. Methods of the invention provide for assembling a semiconductor device by aligning a die with a substrate and interposing solder between corresponding substrate and die bond pads. A lifting force is applied to the die during heating of the solder to a liquescent state, thereby increasing the stand-off height of the die above the substrate. The lifting force is maintained during cooling of the solder to a solid state, thereby forming increased stand-off height solder connections.
Claims14
A method of assembling a semiconductor device comprising the steps of:
- providing a substrate having solder pads;
- placing a semiconductor die in a position for attachment to the substrate, the semiconductor die having bond pads for making solder connections to corresponding bond pads of the substrate;
- interposing solder between corresponding substrate and die bond pads;
- heating the solder to a liquescent state;
- applying a lifting force to the die, thereby increasing the stand-off height of the die above the substrate;
- cooling the solder to a solid state, thereby forming increased stand-off height solder connections between corresponding die bond pads and substrate bond pads;
- removing the lifting force from the die;
- and
- performing finishing steps for completing the semiconductor device.
An integrated circuit assembly comprising:
- a substrate having a plurality of solder pads;
- a semiconductor die adjacent to the substrate and having a plurality of corresponding solder pads aligned with solder pads of the substrate;
- a plurality of solder bonds between corresponding substrate bond pads and die bond pads, whereby the vertical dimension of the solder bonds is greater than the horizontal dimension of the solder bonds, thereby providing an integrated circuit assembly having increased stand-off height.
A system for the manufacture of an increased stand-off height integrated circuit assembly comprising:
- means for aligning a surface mountable die with a substrate;
- means for interposing solder bumps between the die and substrate for the formation of solder bonds;
- means for heating the solder bumps to liquescence;
- means for applying a separating force to increase the stand-off height between the die and the substrate during solder bump liquescence;
- and
- means for permitting the solder to solidify during the application of the separating force, thereby forming increased stand-off height solder joints between the die and substrate.
Dependencies are inferred from the claim text.